3D-MID for Wireless Automotive Applications

The project goal is to develop low-cost, high-performance and highly integrated radar systems that can be directly integrated into plastic surfaces. This will be based upon 3D-MID (Molded Interconnect Device) technology. Radar transceivers integrated in this way will be connected directly to the antennas in order to minimize losses due to reflection, attenuation and phase shift.


Framework Program of the Federal Government of Germany for Research and Innovation 2021 - 2024 "Microelectronics. Trustworthy and sustainable. For Germany and Europe"

Project duration: March 1st, 2023 to February 28th, 2026 - 36 months

Funded by:

Eureka Cluster: