At the Benelux RF Conference 2025, the MID4Automotive consortium presented another significant advancement in the field of next‑generation automotive sensing. In his talk “Molded Interconnect Device Technology Integration of a Photonics‑Based Automotive Radar”, Stephan Kruse from the University of Paderborn showcased how molded interconnect device (MID) technology can serve as a key enabler for compact and highly integrated photonic radar systems.
Kruse introduced the audience to the potential of Molded Interconnect Devices as multifunctional 3D substrates that combine mechanical support, electrical routing, and optical guidance within a single component. By leveraging MID structures, the project aims to integrate optical waveguides, RF conductors, and electronic interfaces into a unified platform—reducing system complexity while improving robustness and manufacturability.
The presentation highlighted design concepts, fabrication approaches, and early experimental results demonstrating how MID‑based integration can streamline the assembly of photonics‑based automotive radar architectures. Particular emphasis was placed on precise alignment of optical paths, stable signal distribution, and the ability to embed high‑frequency structures directly into molded substrates. These capabilities are essential for realizing compact 77‑GHz radar modules with enhanced performance and reduced production cost.
With this contribution, the MID4Automotive consortium reaffirmed its commitment to advancing integrated photonic sensing technologies for future mobility systems. The strong interest from conference participants underscored the relevance of MID‑enabled photonic radar integration as a promising pathway toward miniaturized, high‑resolution automotive sensors.
