At the online Sustainability Workshop on 12 February 2026, several partners from the MID4Automotive and presented forward‑looking approaches showing how mechatronic integrated devices (MID), aluminum‑based circuit carriers, and hybrid printed electronics can contribute to a more sustainable electronics industry. The talks highlighted how material innovation, circular design strategies, and new manufacturing technologies can significantly reduce environmental impact across the entire product life cycle.
In their joint presentation “Circular Electronics Design of ICT Devices on Aluminum Carriers (Mechatronic Integrated Devices)”, Thomas Mager and Bruno Mecke from Fraunhofer IEM, together with colleagues from Fraunhofer IZM and the Łukasiewicz Institutes, introduced the ALU4CED project. They demonstrated how aluminum—thanks to its recyclability, mechanical robustness, and thermal performance—can replace conventional plastic housings in ICT devices. The team presented the concept of ALU‑MID, where aluminum housings are functionalized using LDS‑compatible lacquer, enabling direct integration of antennas, interconnects, and electronic structures on 3D surfaces. The talk also covered adhesion tests, thermal characterization, and the development of a full circular eco‑design strategy, including disassembly concepts, material separation, and CO₂ footprint assessments. Early results showed that recycled aluminum can reduce environmental impact by an order of magnitude compared to primary aluminum, making ALU‑MID a promising path toward circular ICT hardware.
Complementing this perspective, Holst Centre (imec & TNO) presented their work on eco‑designing hybrid and printed electronics. Their contribution emphasized the urgent need to transition away from conventional cradle‑to‑grave PCB technology, which is material‑intensive, difficult to recycle, and heavily dependent on globalized supply chains. The team showcased hybrid printed electronics (HPE) as a lightweight, material‑efficient, and potentially circular alternative. They demonstrated printed sensor arrays, structural electronics, and large‑area lighting systems, highlighting how additive manufacturing, reversible interconnects, and recyclable substrates can drastically reduce environmental impact. Life‑cycle assessments (LCA) presented during the workshop showed significant reductions in CO₂ emissions, resource depletion, and energy consumption when replacing traditional PCBs with printed electronics. The Holst Centre team also outlined a roadmap toward biobased, compostable electronics, reinforcing the long‑term vision of a fully circular electronics value chain.
Together, the presentations provided a comprehensive view of how MID technology, aluminum‑based circuit carriers, and printed electronics can jointly accelerate the transition toward sustainable electronic devices. The workshop clearly demonstrated that circular design principles—combined with innovative materials and manufacturing processes—enable new product architectures that are lighter, more efficient, easier to recycle, and better aligned with future environmental requirements. The strong engagement of participants underscored the growing importance of sustainability‑driven electronics development across industry and research.