Structure-integrated electronics using injection molding for improved radar systems in automobiles
The goal of the project is to develop cost-effective, high-performance, and highly integrated radar systems that can be directly embedded into plastic surfaces. To achieve this, 3D-MID technology (Molded Interconnect Device) is used. The radar transceivers integrated in this way are directly connected to the antennas in order to minimize losses caused by reflection, attenuation, and phase shift.
Federal Government Framework Program for Research and Innovation 2021–2024 “Microelectronics. Trustworthy and Sustainable. For Germany and Europe.”
Project duration: March 1, 2023 to February 28, 2026 – 36 months