The MID4Automotive consortium is pleased to announce that one of the project’s central objectives has been successfully achieved. The interconnection demonstrator developed within the project is now fully operational, marking a significant step forward in the exploration of next generation Molded Interconnect Device (MID) technologies for automotive applications.
At the 17th German Microwave Conference (GeMiC), hosted by the Karlsruhe Institute of Technology (KIT) from March 9–11, 2026, in cooperation with IMA e.V. and VDE/ITG, the public workshop MID Technology for Automotive Applications took place as part of the official conference program.
At the online Sustainability Workshop on 12 February 2026, several partners from the MID4Automotive and presented forward looking approaches showing how mechatronic integrated devices (MID), aluminum based circuit carriers, and hybrid printed electronics can contribute to a more sustainable electronics industry.
f.l.t.r. Prof. Dr.-Ing. Katrin Temmen, Prof. Dr.-Ing. Christoph Scheytt, Dr.-Ing. Stephan Kruse, Prof. Dr.-Ing. Reinhold Noé, Prof. Dr. Christine Silberhorn
The MID4Automotive consortium is pleased to highlight an important academic achievement within its team: the successful completion of a doctoral examination by one of its project members.
As part of the ongoing research efforts within the MID4Automotive project, another significant scientific contribution has been successfully published. The paper “4 Term Noise Parameter Extraction Method and Its Uncertainty for Wideband Low Frequency Receivers” has appeared in the prestigious IEEE Microwave and Wireless Technology Letters.
The MID4Automotive consortium convened in Paderborn on October 29–30, 2025 for a two day project meeting hosted at the Heinz Nixdorf Institute. Partners from across the consortium gathered to review progress, coordinate upcoming activities, and prepare the final phase of the project as it moves toward completion in 2026.
At the European Microwave Week (EuMW) in the Jaarbeurs Center Utrecht, held from September 21–26, 2025, the MID4Automotive consortium successfully showcased the project through a public workshop and the presentation of scientific results. At the booth of the partners Astron and Perisens, project flyers were distributed to interested visitors.
At the International MID Congress 2025 in Amberg, the MID4Automotive consortium presented two key advances demonstrating how MID technology enables the next generation of fully integrated automotive radar systems.
At the Benelux RF Conference 2025, the MID4Automotive consortium presented another significant advancement in the field of next generation automotive sensing. In his talk “Molded Interconnect Device Technology Integration of a Photonics Based Automotive Radar”, Stephan Kruse from the University of Paderborn showcased how molded interconnect device (MID) technology can serve as a key enabler for compact and highly integrated photonic radar…
At the Gemic 2025 conference, held at the Dresden University of Technology, the MID4Automotive consortium once again demonstrated the technological progress achieved within the project. Throughout the event, the consortium partners engaged with researchers, industry representatives, and students, presenting recent scientific results and discussing future directions in photonic and radar based sensing for automotive applications.
At the German Microwave Conference (GeMiC 2025) in Dresden the Circuit & Systen Technology Group at Paderborn University contributed to the program with two publications:
"An Ultra Low Phase Noise Frequency Synthesizer with Optical Output for 77 GHz Photonic Radar" & "A Visible Light FMCW Lidar System Based on LEDs"
The MID4Auto consortium met in Paderborn on 23–24 July 2024 for a two day WP2 System Integration Workshop, hosted at Fraunhofer IEM. Partners from Fujikura, UPB, NXP, Astron, Perisens, TUE, IEM, Konrad, and MID Solutions participated either in person or online.
